AME

Step 1

Printing

The different materials are laid down where required in each cross sectional layer of the electronic component. Circuits can be left open and designed with recesses to allow for the insertion of connectors, microprocessors and integrated circuits.

Step 2

Support Removal

Manual Removal Depends on the structural printing method. Soluble Support Removal Applicable if structural materials use dissolvable supports. Manual Cleaning Note: Minimal mechanical stress applied, especially around conductive traces or embedded components.

Step 3

Surface Finishing

Sanding / Polishing Typically non-applicable; smoothness is critical and controlled during the print process to avoid damaging circuits. Chemical Smoothing / Coating Optional protective coatings may be applied, such as conformal coatings or epoxy encapsulation. Painting / Priming Rare, but may be used for aesthetic enhancement or product housing. Gloss / Matte Control Non-functional; adjusted via outer coatings or finishes if needed.

Step 4

Curing / Heat Treatment

UV / Thermal Curing Critical. Conductive inks (e.g., silver nanoparticle inks) typically require thermal sintering or photonic curing to ensure electrical conductivity. Annealing / Stress Relief Non-applicable.

Step 5

Assembly and Functional Finishing

Gluing or Bonding – Adhesives may be used for external components or hybrid assemblies. Drilling / Tapping / CNC Rare; components are typically embedded or connected during printing to avoid post-machining. Inserts / Fasteners Embedded connectors and sockets may be integrated during the build; mechanical fasteners used for enclosures only.

Step 6

Special Treatments

Infiltration / Sealing Encapsulation or potting used for moisture or impact protection, especially in harsh environments. Functional Coatings Conformal coatings, EMI shielding, or UV-resistant layers for durability and compliance. Post-print Functionalisation Surface-mount or through-hole components may be placed post-print and soldered or bonded using pick-and-place followed by reflow soldering or laser sintering.